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  *Project-WDS Peripheral circuit PCB Design Ver2(Summary)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706266/001/Project%20WDS%20Peripheral%20circuit%20PCB%20Design%20Ver2-Summry170216.pdf|PDF JGW-E1706266]]
  *Project-WDS Peripheral circuit PCB Design Version 2(Detail)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706265/001/Project%20WDS%20Peripheral%20circuit%20PCB%20Design%20Ver2%28Detail%29170217.pdf|PDF JGW-E1706265]]
  *Project-WDS Ex-I/O PCB Design Ver 1(Summary)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706268/002/Project%20WDS%20Ex-IO%20PCB%20Design%20Ver1_1%28Summary%29170217.pdf|PDF JGW-E1706268]]
  *Project-WDS Ex-I/O PCB Design Ver 1(Detail)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706267/001/Project%20WDS%20Ex-IO%20PCB%20Design%20Ver1%28Detail%29170217.pdf|PDF JGW-E1706267]]		    *Project-WDS Peripheral circuit PCB Design Ver2(Summary)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706266/001/Project%20WDS%20Peripheral%20circuit%20PCB%20Design%20Ver2-Summry170216.pdf|PDF JGW-E1706266]]
    *Project-WDS Peripheral circuit PCB Design Version 2(Detail)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706265/001/Project%20WDS%20Peripheral%20circuit%20PCB%20Design%20Ver2%28Detail%29170217.pdf|PDF JGW-E1706265]]
    *Project-WDS Ex-I/O PCB Design Ver 1(Summary)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706268/002/Project%20WDS%20Ex-IO%20PCB%20Design%20Ver1_1%28Summary%29170217.pdf|PDF JGW-E1706268]]
    *Project-WDS Ex-I/O PCB Design Ver 1(Detail)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706267/001/Project%20WDS%20Ex-IO%20PCB%20Design%20Ver1%28Detail%29170217.pdf|PDF JGW-E1706267]]

Agenda/Minutes of the VIS Meeting on 2017/2/17

2017/2/17 13:30 -

Participants:

Progress report

Schedule Chart : (PDF,MPP)

Type-A (Takahashi)

Past week report

Plan for coming weeks

Type B (Mark)

Past week report

Plan for coming weeks

Type-Bp (Shoda)

Past week report

Plan for coming weeks

IMMT (Ohishi)

Past week report

Plan for coming weeks

Watchdog system (Tanaka)

Past week report

  • Items that have been delivered.
    • PCB + Metal mask( for Main board(WSD) )
    • Cream solder
  • Redesign(Front panel board for Main 4ch WDS Box and front panel for Ex-I/O Box)Adjust the spacing of the front panel conectors.

Plan for coming weeks

  • I'm planning to perform surface mounting for Power board(WDS Main 4ch Box) in reflow furnace in Akihabara.Since a large PCB size( 320mm * 100mm) is required,a large reflow furnace is necessary,so it can be borrowed in Akihabara(DMM-make site.And of course,paid).

  • ref Peripheral board(Power)PDF

  • ref Reflow furnaceJapanese

Safety

  • Incidents:
  • Foreseen risks
    • Type-A:
    • Type-B:
    • Type-Bp:

Discussion

  • Mirror disassembly jigs (Hirata)

Travel Plans

  • Travel (Week of 2/20):
    • Takahashi: 20- 24
    • Shoda: 21 - 24
    • Mark: 20 - 24
    • Fabian: 20 - 24
    • Okutomi: 20 - 22
    • Fujii:
    • Ishizaki: 20 - 24
    • Hirata: 20 - 24
    • Sato: 20 - 24
    • Enzo: 20 - 24
    • Hashimoto (Hosei Univ.): 20 - 24
    • Ohishi:
    • Tanaka:
  • Travel (Week of 2/27):
    • Takahashi:
    • Shoda:
    • Mark:
    • Fabian:
    • Okutomi:
    • Fujii:
    • Ishizaki:
    • Hirata:
    • Sato:
    • Enzo:
    • Hashimoto (Hosei Univ.):
    • Someya (Hosei Univ.):
    • Ohishi:
    • Tanaka:

Next meeting

On 2017/2/24(Fri) in Mitaka

March VIS F2F: March 3

KAGRA/Subgroups/VIS/VISMinutes20170217 (last edited 2017-02-17 21:18:27 by YoichiAso)