Differences between revisions 14 and 117 (spanning 103 versions)

Scraps of text for incorporation in the VIS Meeting Minutes

KAGRA/Subgroups/VIS/MeetingNAOJ

Hirata-san:
- Made cables for LVDT.
- Made drawings for new wire clamps.
- Asked ATC for manufacturing parts.(and modified drawings.)
- Asked quotes for SDC coating for hooks.
- Sent packing tools for BF.
- Talked with i-ject about quotes for payload.
Mark and Fabian at Kamioka (plus Enzo for 2 days):
- Finished rebalance of IM
- Reinstalled IRM, adjusted OSEMs
- Replaced broken Type 3 cable on IM-H1 OSEM.
- Fixed issues with k1visbs real-time model.
- Started TFs from IRM OSEMs to IRM and IM OSEMs.

KAGRA/Subgroups/VIS/TypeB/Minutes (last edited 2022-10-28 10:02:46 by fabian.arellano)

-  ⇤ ← Revision 14 as of 2016-05-13 09:39:58 → 
  Size: 1484
  Editor: MarkBarton
  Comment:
+   ← Revision 117 as of 2017-01-13 10:10:32 → ⇥
  Size: 652
  Editor: MarkBarton
  Comment:
-Deletions are marked like this.
+Additions are marked like this.
 Line 5:
- * Type B Past Week Summary
  * Flags and metal prisms ordered; expected 5/31.
  * New assembly drawing [[http://gwdoc.icrr.u-tokyo.ac.jp/cgi-bin/private/DocDB/ShowDocument?docid=5179| D1605179]] focussing on items not part of main chain (and associated screws):
   * Crane adapter
   * Lower breadboard blade module (with cable clamps)
   * IM-RM safety bar ([[http://gwdoc.icrr.u-tokyo.ac.jp/cgi-bin/private/DocDB/ShowDocument?docid=5127| D1605127]] from last week now obsolete)
  * 3D assembly changed to have geophones instead of accelerometers (but SRx will probably be per original design - need to revisit circuit diagram)
  * Concept for load gauge adapter decided (reuse crane adapter plate and jacks from below PI; add Misumi crossbars, cleanroom-compatible chain hoist)
  * Concept for second floor of clean booth decided (remove all floor panels; add bridge panels at right angles: [[attachment:BS Cleanbooth.pdf]])
  * Modified drawings for main assembly frame and drawings for most small parts (jack adapters etc) received from Mirapro.
  * Wire sizes decided: 300 µm piano wire and 500 µm tungsten (will revisit this later).
  * Lots of work on [[http://gwdoc.icrr.u-tokyo.ac.jp/cgi-bin/private/DocDB/ShowDocument?docid=4817| E1604817]] (Fabian) and [[http://gwdoc.icrr.u-tokyo.ac.jp/cgi-bin/private/DocDB/ShowDocument?docid=4235| E1504235]] (Mark)
+ * Hirata-san:
  * Made cables for LVDT.
  * Made drawings for new wire clamps.
  * Asked ATC for manufacturing parts.(and modified drawings.)
  * Asked quotes for SDC coating for hooks.
  * Sent packing tools for BF.
  * Talked with i-ject about quotes for payload.
 * Mark and Fabian at Kamioka (plus Enzo for 2 days):
  * Finished rebalance of IM
  * Reinstalled IRM, adjusted OSEMs
  * Replaced broken Type 3 cable on IM-H1 OSEM.
  * Fixed issues with k1visbs real-time model.
  * Started TFs from IRM OSEMs to IRM and IM OSEMs.