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| * Type B Past Week Summary * Mark and Fabian worked at Kamioka: * All the parts for the security structure were located. The clamp pieces for the IM are being taken back to Mitaka to have extra screw holes added. * The BS/PR2/SR2 area was cleaned and tidied to allow floor removal and assembly frame construction. * 21 "Type 1" cables (PI-Flange, Signal) and 15 "Type 5" cables (OSEM) were tested. They all passed. Sufficient tested "Type 2" cables (PI-Flange, Motor) were located in the PR3 area. * Hirata-san worked on the Inventor assembly, adding views (originally defined by Mark) of the different phases of construction. * Hirata-san shipped 7 SFs and some parts to Kamioka. * Hirata-san made assembly drawings of the damper rings and cable clamps for SR. * Hirata-san liaised with Mirapro about the frame assembly. * Type B ongoing issues * Wires * Need to decide RM wire thickness and order BS and RM wires. Lead time is a few days from Nilaco. * OSEMs * Akutsu-san is working to get wide-mouth OSEMs * Longer cables for BF->PI and SF->PI. * Takahashi-san has ordered extra connectors (due any day) and will get a company to make the cables. * Feedthrough Adapters * Need large quantity of male and female D-Sub 9, IDC ribbon connectors - Takahashi-san is getting a quote. * Can we make SR wire breakers bigger? * Fukushima-san will start on machining test soon (as of 5/27). * Installation stuff * Crane scale - RECEIVED * Ballast masses for payload * Initial batch received - ordered extra smaller ones to allow for adjustments. * Lower breadboard stuff * Installation to be incorporated into the procedure document. Mark/Takahashi to discuss. * Breadboard springs (in manufacture, expected end of July) * Nail-head parts: quote from Mirapro received, not urgent, will be combined with assembly frame order. * Documents * BS Assembly Procedure [[http://gwdoc.icrr.u-tokyo.ac.jp/cgi-bin/private/DocDB/ShowDocument?docid=4235| E1504235]], [[https://onedrive.live.com/redir?resid=D5CCFA70A378E0D0!195&authkey=!AM_usynuo9QI57g&ithint=folder,webloc|E1504235 draft]] |
* Type B Past Week Summary, weeks of 9/19 and 9/26 * Fabian, Mark and Liu-kun did BS installation at Kamioka: * Connected the DIO card to the LPCD. (Simulink model changes will be needed to make use of it.) * Took TF data from the TM-H1 coil output to the voltage and current monitors and found that the response was approximately flat, meaning that meaningful TFs can be taken of the RM/BS stage with no DIO. * Used the 90° prism and the optical lever to set the pitch of the RM to match the dummy BS. * Removed the RM trolley and added the bottom section of the security structure. * Lifted the IM/RM/BS with the load gauge adapter and load gauge and measured its mass. * Hirata-san: * Modified drawing of maraging rods for BS [[http://gwdoc.icrr.u-tokyo.ac.jp/cgi-bin/private/DocDB/ShowDocument?docid=5706| D1605706]] * Made 3D models of stub flag gluing jigs. * Made 3D models and 2D drawing of BS BF-IM hexagon cable clamp assembly and cone parts. [[http://gwdoc.icrr.u-tokyo.ac.jp/cgi-bin/private/DocDB/ShowDocument?docid=5734| D1605734]] * Washed parts and screws. * (For Type A) Assembled and adjusted blades of BF #9. * Longer term to-do list * Do Inventor assembly for SRx in chamber and on assembly frame (Hirata) - SR2/SR3 DONE, SRM ongoing. * Part "disk security" top has to be modified - screw positions do not match. * Write more of payload assembly procedure (Fabian) - ONGOING * Write more of BS Assembly Procedure [[http://gwdoc.icrr.u-tokyo.ac.jp/cgi-bin/private/DocDB/ShowDocument?docid=4235| E1504235]], [[https://onedrive.live.com/redir?resid=D5CCFA70A378E0D0!195&authkey=!AM_usynuo9QI57g&ithint=folder,webloc|E1504235 draft]] (Mark) - ONGOING * Lower breadboard installation to be incorporated into the procedure document. * Work on BS simulation (Fabian) * Do BS Simulink model (Mark, Kokeyama) - TM/IM/BF level DONE * Do 2D drawings of SR2 parts (Hirata) * Redesign SRx IM wire clamps for larger prisms, remachined RMs * Order SRM/PRM parts (Hirata/Shoda) * Order SRx fasteners (Hirata) |
Scraps of text for incorporation in the VIS Meeting Minutes
KAGRA/Subgroups/VIS/MeetingNAOJ
- Type B Past Week Summary, weeks of 9/19 and 9/26
- Fabian, Mark and Liu-kun did BS installation at Kamioka:
- Connected the DIO card to the LPCD. (Simulink model changes will be needed to make use of it.)
- Took TF data from the TM-H1 coil output to the voltage and current monitors and found that the response was approximately flat, meaning that meaningful TFs can be taken of the RM/BS stage with no DIO.
- Used the 90° prism and the optical lever to set the pitch of the RM to match the dummy BS.
- Removed the RM trolley and added the bottom section of the security structure.
- Lifted the IM/RM/BS with the load gauge adapter and load gauge and measured its mass.
- Hirata-san:
- Fabian, Mark and Liu-kun did BS installation at Kamioka:
- Longer term to-do list
- Do Inventor assembly for SRx in chamber and on assembly frame (Hirata) - SR2/SR3 DONE, SRM ongoing.
- Part "disk security" top has to be modified - screw positions do not match.
- Write more of payload assembly procedure (Fabian) - ONGOING
Write more of BS Assembly Procedure E1504235, E1504235 draft (Mark) - ONGOING
- Lower breadboard installation to be incorporated into the procedure document.
- Work on BS simulation (Fabian)
- Do BS Simulink model (Mark, Kokeyama) - TM/IM/BF level DONE
- Do 2D drawings of SR2 parts (Hirata)
- Redesign SRx IM wire clamps for larger prisms, remachined RMs
- Order SRM/PRM parts (Hirata/Shoda)
- Order SRx fasteners (Hirata)
- Do Inventor assembly for SRx in chamber and on assembly frame (Hirata) - SR2/SR3 DONE, SRM ongoing.