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Deletions are marked like this. | Additions are marked like this. |
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* Fabian took photos of the cleanroom in the ATC. * Hirata-san ordered wire for the BS. * Fabian weighed the masses that he'd been constructing in the cleanroom and found a 600 g discrepancy from the Inventor. * Hirata-san ordered a medium-capacity scale to help check the masses of the parts. * Type B ongoing issues * OSEMs * Akutsu-san is working to get wide-mouth OSEMs * Longer cables for BF->PI and SF->PI. * Connectors RECEIVED, cables being made. * SR machining test ongoing. * Lower breadboard stuff * Installation to be incorporated into the procedure document. Mark/Takahashi to discuss. * Breadboard springs (in manufacture, expected end of July) * Nail-head parts - RECEIVED. * Documents * BS Assembly Procedure [[http://gwdoc.icrr.u-tokyo.ac.jp/cgi-bin/private/DocDB/ShowDocument?docid=4235| E1504235]], [[https://onedrive.live.com/redir?resid=D5CCFA70A378E0D0!195&authkey=!AM_usynuo9QI57g&ithint=folder,webloc|E1504235 draft]] * To-do list during Mark's vacation * Apply grease to jacks for assembly frame (Takahashi) * Finish assembly of BS IM, RM and IRM (Fabian). * Weigh IM/RM/IRM (Fabian, Hirata) * Pack/ship IM/RM/IRM to Kamioka (Hirata/Fabian). * Analyze geophone data (Mark, Shoda) * Remove glue from dummy BS face (Fabian) * Remove prism from dummy BS (Hirose, Fabian?) * Reglue flags and prisms (Tatsumi, Fabian) * Buy wire for BS and RM (Hirata) * Clean wire for BS and RM (Hirata) * Do fit/function test of winches (Fabian/Hirata) * Ship winches to Kamioka (Hirata/Fabian) |
* Fabian, Mark and Liu-kun did BS installation at Kamioka: * Connected the DIO card to the LPCD. (Simulink model changes will be needed to make use of it.) * Took TF data from the TM-H1 coil output to the voltage and current monitors and found that the response was approximately flat, meaning that meaningful TFs can be taken of the RM/BS stage with no DIO. * Used the 90° prism and the optical lever to set the pitch of the RM to match the dummy BS. * Removed the RM trolley and added the bottom section of the security structure. * Lifted the IM/RM/BS with the load gauge adapter and load gauge and measured its mass. * Hirata-san: * Modified drawing of maraging rods for BS [[http://gwdoc.icrr.u-tokyo.ac.jp/cgi-bin/private/DocDB/ShowDocument?docid=5706| D1605706]] * Made 3D models of stub flag gluing jigs. * Made 3D models and 2D drawing of BS BF-IM hexagon cable clamp assembly and cone parts. [[http://gwdoc.icrr.u-tokyo.ac.jp/cgi-bin/private/DocDB/ShowDocument?docid=5734| D1605734]] * Washed parts and screws. * (For Type A) Assembled and adjusted blades of BF #9. * Mark checked lots of drawings by Hirata-san. * Mark worked on schedule but only succeeded in completely garbling the Type B section of the VIS schedule on the server. * Longer term to-do list * Do Inventor assembly for SRx in chamber and on assembly frame (Hirata) - SR2/SR3 DONE, SRM ongoing. * Part "disk security" top has to be modified - screw positions do not match. * Write more of payload assembly procedure (Fabian) - ONGOING * Write more of BS Assembly Procedure [[http://gwdoc.icrr.u-tokyo.ac.jp/cgi-bin/private/DocDB/ShowDocument?docid=4235| E1504235]], [[https://onedrive.live.com/redir?resid=D5CCFA70A378E0D0!195&authkey=!AM_usynuo9QI57g&ithint=folder,webloc|E1504235 draft]] (Mark) - ONGOING * Lower breadboard installation to be incorporated into the procedure document. |
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* Do Inventor assembly for SR2 in chamber and on assembly frame (Hirata) * Apply vacuum grease to jacks for BS assembly frame (Takahashi) * Write more of payload assembly procedure (Fabian) * Write more of main assembly procedure (Mark) * Longer term to-do list * Do BS Simulink model (Mark, Kokeyama) |
* Do BS Simulink model (Mark, Kokeyama) - TM/IM/BF level DONE |
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* Redesign SRx IM wire clamps for larger prisms, remachined RMs. | * Redesign SRx IM wire clamps for larger prisms, remachined RMs |
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* Check SR RM machining test progress (Hirata) |
Scraps of text for incorporation in the VIS Meeting Minutes
KAGRA/Subgroups/VIS/MeetingNAOJ
- Type B Past Week Summary
- Fabian, Mark and Liu-kun did BS installation at Kamioka:
- Connected the DIO card to the LPCD. (Simulink model changes will be needed to make use of it.)
- Took TF data from the TM-H1 coil output to the voltage and current monitors and found that the response was approximately flat, meaning that meaningful TFs can be taken of the RM/BS stage with no DIO.
- Used the 90° prism and the optical lever to set the pitch of the RM to match the dummy BS.
- Removed the RM trolley and added the bottom section of the security structure.
- Lifted the IM/RM/BS with the load gauge adapter and load gauge and measured its mass.
- Hirata-san:
- Mark checked lots of drawings by Hirata-san.
- Mark worked on schedule but only succeeded in completely garbling the Type B section of the VIS schedule on the server.
- Fabian, Mark and Liu-kun did BS installation at Kamioka:
- Longer term to-do list
- Do Inventor assembly for SRx in chamber and on assembly frame (Hirata) - SR2/SR3 DONE, SRM ongoing.
- Part "disk security" top has to be modified - screw positions do not match.
- Write more of payload assembly procedure (Fabian) - ONGOING
Write more of BS Assembly Procedure E1504235, E1504235 draft (Mark) - ONGOING
- Lower breadboard installation to be incorporated into the procedure document.
- Work on BS simulation (Fabian)
- Do BS Simulink model (Mark, Kokeyama) - TM/IM/BF level DONE
- Do 2D drawings of SR2 parts (Hirata)
- Redesign SRx IM wire clamps for larger prisms, remachined RMs
- Order SRM/PRM parts (Hirata/Shoda)
- Order SRx fasteners (Hirata)
- Do Inventor assembly for SRx in chamber and on assembly frame (Hirata) - SR2/SR3 DONE, SRM ongoing.