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= VIS Type B Near Term To-Do List = | = VIS Type B BS Near Term To-Do List = |
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[[../ToDoOld|Archived To-Do Items]] | [[../ToDoOldBS|Archived BS To-Do Items]] [[../ToDoSR|SR To-Do Items]] |
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[[#RealBSHang|Preparation for Real BS Hang]] [[#SRPrepTasks|Preparation for SR Installation]] |
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== 2017-08-21 == === Design/Documentation/Planning === * Update BS Install Procedure with screenshots from new on-assembly-frame 3D CAD. |
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=== Main Assembly === * --(Wrap new IM bottom ballast masses (Mozumi).)-- * --(Install new IM masses.)-- * --(Set up optical level.)-- * --(Adjust IM ballast mass to give desired roll/pitch/vertical.)-- * --(Level BF.)-- * --(Cable BF LVDT, test and calibrate.)-- * --(Adjust top of IRM to level.)-- * --(Install IRM side panels.)-- * --(Install IRM OSEMs.)-- * --(Cable IRM OSEMs)-- and test. * --(Adjust IRM and IRM OSEMs to get good alignment of IRM OSEMs and IM-IRM stops.)-- * Add extra ballast mass to BF. * Add BF cap but don't anchor cables. * Cable and test BF cap picos. * Lift BF/IRM/IM/RM/BS and weigh. * Adjust BF ballast if necessary. * Crane in SF. * Hook up BF/IRM/IM/RM/BS. * Route cables up to SF. * Adjust BF ballast if necessary. |
== ASAP == |
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=== Time permitting === * Lay more new in-air cabling. |
* Calibrate LEN OL * Ask commissioning team for window of opportunity. * Turn off TILT OL control. * Uncover breadboard. * Scan LEN QPD in horizontal and vertical while noting output. * Recenter LEN QPD. * Re-cover breadboard. * Re-engage TILT control. === Main Assembly Sequence === * Necessary for phase-I★★★ * --(Modify IP LVDT damping filters to include set point.)-- * --(TFs.)-- * '''''EXCHANGE YAW/VERT FRs at F0''''' * Check IP BIO is working or not. * Necessary for phase-II★★ * Calibrate IP LVDT actuation against IP LVDT sensing. (Klog 3553? http://klog.icrr.u-tokyo.ac.jp/osl/?r=3553) * Design PI Sensor blending filter. * Re-calibrate F0 GAS LVDT * Tune the LVDT sensitivity * Measure IP period; adjust ballast mass. * At some point (remotely)★ * Improve OL offloading. * Improve GAS offloading. * Spectral analysis of Oplev. * Design, install angular lock servo using OL. (Almost done for phase-I) * Adjust gains and debug damping for IM OSEMs and GAS LVDTs. (Almost done for phase-I) * Subtract DC level of Geophones. * Spectra analysis of PI sensors (PI LVDTs and Geophones). * Calibrate IP LVDT sensing against IP LVDT actuation, IP FRs. * Set all EQ stops to TBD clearance. * Modify the model for IP coil driver control === Documentation and Operation Manual === * Add useful info from Enzo's notebook to BSData. |
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== Real BS Hang Tasks == | == Tasks Not To Forget == |
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* Move safety bars from BS AF area to SR2 area. * Close hole in floor above BS AF area. * Update circuit diagram. * (Time permitting) Try adding mass to IP. * Update BS Install Procedure with screenshots from new on-assembly-frame 3D CAD. |
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* Get pico drive screens fixed (Miyo-kun) * --(Final ballast mass production for BF and SF (Hirata-san). )-- * --(Design of receptacles for rods with 8 mm heads.)-- * --(Possible rebuild of BF)-- * --(Set up build/test stand for filters.)-- * --(Get filter test weights.)-- * --(Find spare BF blade(s).)-- * Reclean stuff: * PI (remove Kapton tape etc, etc). * LLB damper stuff, especially Cu segments. * Calibrate SF LVDT. * Calibrate PI vertical LVDT. * Set yoke on PI vertical LVDT (if necessary). * Calibrate PI horizontal LVDTs. |
* Figure out how to make PI yaw adjustment reliable. |
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* Get clean bag laundered. | |
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* --(Swap out temporary ballast mass in BF)--, SF. | |
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* Lock washers for LBB dampers | |
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* --(Wide-mouth OSEMs from RM to Akutsu-san)-- * --(Adjust height of crossbars below BF.)-- * --(If possible, fix galled pole in BF level of EQ stop.)-- * Swap in new F0-SF maraging rod (with 8-mm heads) and new receptacles to match. * --(Check inside SF for lost ruler.)-- * Tighten PI yaw return spring. * Get Cu O-rings for feedthroughs. |
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<<Anchor(elec)>> | |
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* Decide final in-vacuum and in-air cable routing (Enzo). * Calibrate all LVDTs (Enzo, Mark). --(BF)--, SF, PI-GAS, PI-H1, PI-H2, PI-H3 * --(Remove cling wrap in BF and install vacuum-compatible heat shrink.)-- * Remove cling wrap on connections for PI vertical stepper and install vacuum-compatible heat shrink (needs wider diameter heat shrink or smaller pins). * Rewire PI horizontal steppers with vacuum-compatible cable. * Adjust yoke on BF to put top of secondary at 3.5 mm above top of baseplate (or to give ≈0 counts at nominal height). * Adjust yoke on SF to put top of secondary at 6 mm above top of baseplate (or to give ≈0 counts at nominal height). * Adjust yoke on PI to put top of secondary at TBD mm above top of baseplate (or to give ≈0 counts at nominal height). |
* Update BS Circuit diagram, D1503600 * Make generic for BS+SRx??? No, there are some differences. Still we need to summarize. * --(Note removal of LED/PD on TM OSEMs.)-- * Include information on assignment of channels to feedthrough positions. * Reflect gender-changers and non-flipping feedthrough adapters. * Reflect actual cable lengths. * Include LVDT pin size (1 mm). * Include Stepper pin size (1.6 mm). * Undo renumbering of IP items. * --(Page 10: "DIO Card # 0" should be "DIO Card # 1")-- * --(Include OutConfigBoards on OL page (Sheet 18).)-- |
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* Design and install GAS drift compensation filters. * Create a proper DAC Monitor MEDM screen. * Improve ADC Monitor MEDM screen. <<Anchor(SRPrepTasks)>> == SR Prep Tasks == === Design/Purchasing === * Do rough mass budget for SR2/SR3/SRM. * Design SR assembly frame. * Design final SF ballast masses (Fabian). ==== Order now ==== * Bread boards for SR -> すぐ見積り依頼 * Include installation work in the contract * Total budget = 5MJPY * PEEK collet for "Small hexagon"(cable clamp) -> すぐ見積り依頼 ==== Need simple design changes ==== * SUS wires(3 types) for the LBB * Change the length -> すぐ見積り依頼 * Receptacles for Bread board damper * There is a mistake in the PROMEC drawing. * Hirata-san will make a new 2D drawing * IM wire clamps for SR * Need to change the height * SR assembly frame -> 月曜日に見積り依頼 * Mark is checking the design from Fabian * We should order the parts necessary to modify the BS assembly frame to the SR2 assembly frame ==== Need Fabian's input ==== * Cable clamps for BF,SF and PI -> 方式を決める * Design change for the PI clamps, because the SR PIs are NIKHEF ones. * Ballast masses for BF and SF * 製作に2週間程度 * 10月頭にTop Filterの最適荷重を実測。それに合わせて発注。それまでにデザインは用意しておく。 * 測定に必要な物品の準備 -> 月曜日に高橋さんと相談 ==== Need more discussion/checks ==== * Blade spring assembly for LBB * Check the load of the LBB and decide the design load of the springs * Correct the length * Scale the width of the current blades to design the new blades -> 高橋さんと相談 * SR用LBBの重さを確認 * Bread board damper rings * Need to check whether we can put a full ring into the chamber from the side flanges or not. -> 至急確認 === Electronics === * Get cables/cards for SR3: * 5 DSub-37 cables (tent) * 5 DSub-15M to DSub-9M adapter cables (tent) * 3 DIO cards (tent) * 2 DSub-9 FF gender benders (for LVDTs) * extra ADC card(s)? * extra DAC card(s)? * BNC-LEMO adapter (for LVDTs) * etc |
VIS Type B BS Near Term To-Do List
Every Week
Facilities
- Vacuum and roll floor.
- Wipe ladders.
- Tidy tools, parts.
Get stuff from ../WishList
ASAP
- Calibrate LEN OL
- Ask commissioning team for window of opportunity.
- Turn off TILT OL control.
- Uncover breadboard.
- Scan LEN QPD in horizontal and vertical while noting output.
- Recenter LEN QPD.
- Re-cover breadboard.
- Re-engage TILT control.
Main Assembly Sequence
- Necessary for phase-I★★★
Modify IP LVDT damping filters to include set point.
TFs.
EXCHANGE YAW/VERT FRs at F0
- Check IP BIO is working or not.
- Necessary for phase-II★★
Calibrate IP LVDT actuation against IP LVDT sensing. (Klog 3553? http://klog.icrr.u-tokyo.ac.jp/osl/?r=3553)
- Design PI Sensor blending filter.
- Re-calibrate F0 GAS LVDT
- Tune the LVDT sensitivity
- Measure IP period; adjust ballast mass.
- At some point (remotely)★
- Improve OL offloading.
- Improve GAS offloading.
- Spectral analysis of Oplev.
- Design, install angular lock servo using OL. (Almost done for phase-I)
- Adjust gains and debug damping for IM OSEMs and GAS LVDTs. (Almost done for phase-I)
- Subtract DC level of Geophones.
- Spectra analysis of PI sensors (PI LVDTs and Geophones).
- Calibrate IP LVDT sensing against IP LVDT actuation, IP FRs.
- Set all EQ stops to TBD clearance.
- Modify the model for IP coil driver control
Documentation and Operation Manual
- Add useful info from Enzo's notebook to BSData.
Tasks Not To Forget
Major Tasks
- Move safety bars from BS AF area to SR2 area.
- Close hole in floor above BS AF area.
- Update circuit diagram.
- (Time permitting) Try adding mass to IP.
- Update BS Install Procedure with screenshots from new on-assembly-frame 3D CAD.
- Finish assembly drawing for LBB and LBB damper ring and post on JGWDoc (Hirata-san).
- Figure out how to make PI yaw adjustment reliable.
Minor Tasks
Mechanical
- Put pointy-tipped screw in RM trolley for BS
- Return/replace borrowed parts:
- Temporary ballast mass (dog clamps) in BF.
Electrical
- Update BS Circuit diagram, D1503600
- Make generic for BS+SRx??? No, there are some differences. Still we need to summarize.
Note removal of LED/PD on TM OSEMs.
- Include information on assignment of channels to feedthrough positions.
- Reflect gender-changers and non-flipping feedthrough adapters.
- Reflect actual cable lengths.
- Include LVDT pin size (1 mm).
- Include Stepper pin size (1.6 mm).
- Undo renumbering of IP items.
Page 10: "DIO Card # 0" should be "DIO Card # 1"
Include OutConfigBoards on OL page (Sheet 18).
Real-time and SUMCON models
- Create SUMCON models for full BS and major installation milestones.
Create controls design description (cf LIGO-T1100378).
- Make table of ADC/DAC assignments and check for consistency with D1503600 and k1visbs (Enzo, Mark)
- Understand/document/debug Kokeyama-san's DIO stuff.
- Measure LPCD and HPCD output filter response.
- Design and install software compensation filters for LPCD and HPCD output filters.