Differences between revisions 99 and 100
Revision 99 as of 2017-07-30 15:16:14
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Editor: MarkBarton
Comment:
Revision 100 as of 2017-07-30 16:59:02
Size: 4619
Editor: MarkBarton
Comment:
Deletions are marked like this. Additions are marked like this.
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== Coming Weeks 2017-07-24 == == 2017-07-31 ==
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 * Re-secure floor panels around tank.
 * Wipe entire frame; blow dust out of grooves.
 * Organize new OL for setting BS pitch (Fabian).
Line 27: Line 30:
 * Organize new OL for setting BS pitch (Fabian).
Line 29: Line 31:
 * Finish assembly drawing for LBB and LBB damper ring and post on JGWDoc (Hirata-san).
 * LBB ballast mass.
  * Research real payload.
  * Do improved mass budget.
Line 35: Line 33:
 * --(Look for LVDT driver box Syyxx3134.)--
 * --(Make sure SR3 boxes have notes on their JGW-S.... document pages.)--
Line 39: Line 35:
 * --(Remove BF-SF cables (note which had gender benders and which had extensions).)--
 * --(Remove SF.)--
 * --(Remove SF SS ring and poles.)--
 * --(Move (or remove) SF AF crossbars.)--
 * --(Remove IRM.)--
 * --(Remove old BF.)--
 * --(Remove RM and dummy BS.)--
 * Check centering of IM picos.
 * --(Characterize blades (1,2,3,4,5,6,7).)--
 * --(Rebuild BF.)--
 * Remove dummy BS from RM.
 * Install coil-only OSEMs.
 * Measure coil resistances of wide-mouth OSEMs, new coil-only OSEMS (for Michimura-san).
 * Look up log book to find serial numbers of old coil+sensor RM OSEMs.
 * Pack RM coil+sensor OSEMs, label them with original serial numbers, and return them to Akutsu-san.
 * Remove IM end panel and check centering of IM picos.
 * Reassemble top of AF.
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 * --(Check gluing result.)--
 * --(Cleanup optic after failed secondary prism bonds.)--
 * --(Cleanup jigs/prisms after failed secondary prism bonds.)--
 * --(Reglue secondary prisms.)--
 * Move NB-03 jacks at PI level of AF to top level.
 * Set height, level of IM support screws.
 * Install IM.

=== Time permitting ===
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 * Finish assembly drawing for LBB and LBB damper ring and post on JGWDoc (Hirata-san).
 * LBB ballast mass.
  * Research real payload.
  * Do improved mass budget.

VIS Type B Near Term To-Do List

Archived To-Do Items

Every Week

Coming Weeks

Preparation for Real BS Hang

Preparation for SR Installation

Every Week

Facilities

  • Vacuum and roll floor.
  • Wipe ladders.
  • Tidy tools, parts.
  • Get stuff from ../WishList

2017-07-31

Facilities

  • Re-secure floor panels around tank.
  • Wipe entire frame; blow dust out of grooves.
  • Organize new OL for setting BS pitch (Fabian).

Design/Documentation/Planning

  • Do version of 3D CAD with final-hang arrangement of suspension and LBB damper stuff (Hirata-san).

Electronics

Main Assembly

  • Remove dummy BS from RM.
  • Install coil-only OSEMs.
  • Measure coil resistances of wide-mouth OSEMs, new coil-only OSEMS (for Michimura-san).
  • Look up log book to find serial numbers of old coil+sensor RM OSEMs.
  • Pack RM coil+sensor OSEMs, label them with original serial numbers, and return them to Akutsu-san.
  • Remove IM end panel and check centering of IM picos.
  • Reassemble top of AF.
  • Check verticality of AF, height of crossbars, centering of optical table.
  • Move NB-03 jacks at PI level of AF to top level.
  • Set height, level of IM support screws.
  • Install IM.

Time permitting

  • Remove LBB rings.
  • Send rings for recleaning.

Real BS Hang Tasks

Major Tasks

  • Finish assembly drawing for LBB and LBB damper ring and post on JGWDoc (Hirata-san).
  • LBB ballast mass.
    • Research real payload.
    • Do improved mass budget.
  • Get pico drive screens fixed (Miyo-kun)
  • Final ballast mass production for BF and SF (Hirata-san). (have quotes)
  • Design of receptacles for rods with 8 mm heads.
  • Possible rebuild of BF and/or SF
    • Set up build/test stand for filters.
    • Get filter test weights.
    • Find spare BF blade(s).
  • Reclean stuff:
    • PI (remove Kapton tape etc, etc).
    • LLB damper stuff, especially Cu segments.
  • Calibrate PI vertical LVDT.
  • Set yoke on PI vertical LVDT (if necessary).
  • Calibrate PI horizontal LVDTs.
  • Unlock BF keystone and try running BF fishing rod to fix sag problem.

Minor Tasks

Mechanical

  • Get clean bag laundered.
  • Put pointy-tipped screw in RM trolley for BS
  • Swap out temporary ballast mass in BF, SF.
  • Return/replace borrowed parts:
    • Lock washers for LBB dampers
    • Temporary ballast mass (dog clamps) in BF.
    • Wide-mouth OSEMs from RM to Akutsu-san
  • Adjust height of crossbars below BF.
  • If possible, fix galled pole in BF level of EQ stop.
  • Swap in new F0-SF maraging rod (with 8-mm heads) and new receptacles to match.
  • Check inside SF for lost ruler.
  • Tighten PI yaw return spring.
  • Get Cu O-rings for feedthroughs.

Electrical

  • Decide final in-vacuum and in-air cable routing (Enzo).
  • Calibrate all LVDTs (Enzo, Mark).
  • Remove cling wrap in BF and install vacuum-compatible heat shrink.
  • Remove cling wrap on connections for PI vertical stepper and install vacuum-compatible heat shrink (needs wider diameter heat shrink or smaller pins).
  • Rewire PI horizontal steppers with vacuum-compatible cable.
  • Adjust yoke on BF to put top of secondary at 6 mm above top of baseplate (or to give ≈0 counts at nominal height).

Real-time and SUMCON models

  • Create SUMCON models for full BS and major installation milestones.
  • Create controls design description (cf LIGO-T1100378).

  • Make table of ADC/DAC assignments and check for consistency with D1503600 and k1visbs (Enzo, Mark)
  • Understand/document/debug Kokeyama-san's DIO stuff.
  • Measure LPCD and HPCD output filter response.
  • Design and install software compensation filters for LPCD and HPCD output filters.
  • Design and install GAS drift compensation filters.
  • Create a proper DAC Monitor MEDM screen.
  • Improve ADC Monitor MEDM screen.

SR Prep Tasks

Design/Purchasing

  • Do rough mass budget for SR2/SR3/SRM.
  • Design SR assembly frame.
  • Design final SF ballast masses (Fabian).

Electronics

  • Get cables/cards for SR3:
    • 5 DSub-37 cables (tent)
    • 5 DSub-15M to DSub-9M adapter cables (tent)
    • 3 DIO cards (tent)
    • 2 DSub-9 FF gender benders (for LVDTs)
    • extra ADC card(s)?
    • extra DAC card(s)?
    • BNC-LEMO adapter (for LVDTs)
    • etc

KAGRA/Subgroups/VIS/TypeB/ToDoBS (last edited 2019-01-04 15:21:23 by MarkBarton)