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Size: 1374
Comment:
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Size: 2372
Comment:
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| Deletions are marked like this. | Additions are marked like this. |
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| * Put a report here |
* [[http://gwwiki.icrr.u-tokyo.ac.jp/JGWwiki/KAGRA/Subgroups/VIS/TypeA/Meeting|Minutes of Type-A Meeting]] * EYV chamber: Top chamber was connected again. * Pre-isolator: The pre-isolators for SR were packed and moved out of the large clean room on 23rd. * BF damper: Checked delivered parts on 24th. * Maraging wire: The wires are delivered on 31st. They are sent to the thermal proccess on 1st February. The 3.3m wire can be treated at Himeji facility of Kinzoku-giken. * Preparation of installation: The floor of clean booth was covered by stainless steel sheet. The foot holds were assembled. Other large tools (rack, wagon, desk, so on) also were installed into the clean booth. |
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| * Put a report here | * WDS PCB Design Document.Main rack( Main board + peripheral board )design. *Correction of PCB design and correction by DRC(by manufacturer).[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0061/E1706101/001/Project%20WDS%20PCB%20Design%20Ver1%28Detail%29170127.pdf|PDF(JGW-E1706101)]] |
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| * Hashimoto (Hosei Univ.): * Someya (Hosei Univ.): |
Agenda/Minutes of the VIS Meeting on 2017/1/27
2017/1/27 13:30 -
Participants:
Progress report
Type-A (Takahashi)
- EYV chamber: Top chamber was connected again.
- Pre-isolator: The pre-isolators for SR were packed and moved out of the large clean room on 23rd.
- BF damper: Checked delivered parts on 24th.
- Maraging wire: The wires are delivered on 31st. They are sent to the thermal proccess on 1st February.
- The 3.3m wire can be treated at Himeji facility of Kinzoku-giken.
- Preparation of installation: The floor of clean booth was covered by stainless steel sheet. The foot holds were assembled.
- Other large tools (rack, wagon, desk, so on) also were installed into the clean booth.
Type B (Mark)
- Put a report here
Type-Bp (Shoda)
- Put a report here
IMMT (Ohishi)
- Put a report here
Watchdog system (Tanaka)
- WDS PCB Design Document.Main rack( Main board + peripheral board )design.
Correction of PCB design and correction by DRC(by manufacturer).PDF(JGW-E1706101)
Safety
- Incidents:
- Foreseen risks
- Type-A:
- Type-B:
- Type-Bp:
Discussion
- Smaller coil design status update (Aso)
Site work plan for the next week
- Mon:
- Tue:
- Wed:
- Thu:
- Fri:
Travel Plans
- Travel (Week of 1/30):
- Takahashi: 30-2/3
- Shoda: 31-2/3
- Mark: 30-2/3
- Fabian:
- Okutomi: 30-2/3
- Fujii:
- Ishizaki: 30-2/3
- Hirata:
- Sato: 30-2/3
- Enzo: 30-2/3
- Hashimoto (Hosei Univ.):
- Someya (Hosei Univ.):
- Ohishi:
- Travel (Week of 2/6):
- Takahashi:
- Shoda:
- Mark:
- Fabian:
- Okutomi:
- Fujii:
- Ishizaki:
- Hirata:
- Sato:
- Enzo:
- Hashimoto (Hosei Univ.):
- Someya (Hosei Univ.):
- Ohishi:
Next meeting
On 2017/2/3(Fri) VIS F2F: Feb. 17th