Agenda/Minutes of the VIS Meeting on 2017/1/27

2017/1/27 13:30 -

Participants:

Progress report

Schedule Chart : (PDF,MPP)

Type-A (Takahashi)

• Minutes of Type-A Meeting

• EYV chamber: Top chamber was connected again.
• Pre-isolator: The pre-isolators for SR were packed and moved out of the large clean room on 23rd.
• BF damper: Checked delivered parts on 24th.
• Maraging wire: The wires are delivered on 31st. They are sent to the thermal proccess on 1st February.
  • The 3.3m wire can be treated at Himeji facility of Kinzoku-giken.
• Preparation of installation: The floor of clean booth was covered by stainless steel sheet. The foot holds were assembled.
  • Other large tools (rack, wagon, desk, so on) also were installed into the clean booth.

Type B (Mark)

• Put a report here

Type-Bp (Shoda)

• Put a report here

IMMT (Ohishi)

• Put a report here

Watchdog system (Tanaka)

• WDS PCB Design Document.Main rack( Main board + peripheral board )design.

  • Correction of PCB design and correction by DRC(by manufacturer).PDF(JGW-E1706101)

Safety

• Incidents:
• Foreseen risks
  • Type-A:
  • Type-B:
  • Type-Bp:

Discussion

• Smaller coil design status update (Aso)

Site work plan for the next week

• Mon:
• Tue:
• Wed:
• Thu:
• Fri:

Travel Plans

• Travel (Week of 1/30):
  • Takahashi: 30-2/3
  • Shoda: 31-2/3
  • Mark: 30-2/3
  • Fabian:
  • Okutomi: 30-2/3
  • Fujii:
  • Ishizaki: 30-2/3
  • Hirata:
  • Sato: 30-2/3
  • Enzo: 30-2/3
  • Hashimoto (Hosei Univ.):
  • Someya (Hosei Univ.):
  • Ohishi:
• Travel (Week of 2/6):
  • Takahashi:
  • Shoda:
  • Mark:
  • Fabian:
  • Okutomi:
  • Fujii:
  • Ishizaki:
  • Hirata:
  • Sato:
  • Enzo:
  • Hashimoto (Hosei Univ.):
  • Someya (Hosei Univ.):
  • Ohishi:

Next meeting

On 2017/2/3(Fri) VIS F2F: Feb. 17th