|
Size: 1398
Comment:
|
Size: 1980
Comment:
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| Deletions are marked like this. | Additions are marked like this. |
| Line 8: | Line 8: |
| Schedule Chart : ([[https://www.dropbox.com/s/rlnmlt3uipcsai8/VIS%20Overall%20Schedule-20170121.pdf?dl=0|PDF]],[[https://www.dropbox.com/s/rlnmlt3uipcsai8/VIS%20Overall%20Schedule-20170121.pdf?dl=0|MPP]]) | Schedule Chart : ([[https://www.dropbox.com/s/3fllgzwp4wlew2k/VIS%20Overall%20Schedule-20170322.pdf?dl=0|PDF]],[[https://www.dropbox.com/s/agsjc8jqo2t6vxu/VIS%20Overall%20Schedule-20170322.mpp?dl=0|MPP]]) |
| Line 28: | Line 28: |
| *Manufacturing test(Solder reflow process) *The Power unit(substrate) is divided and processed in a reflow oven. There is no problem even though some solder leakage occurs on the upper part surface. *Operational test(Power unit for 4ch WDS main box) *Continuous operation for 6 hours at twice normal load(334mA). Representation temperature of component surface(upper part) is 51℃(at room temp. 22℃). -->no problem. |
|
| Line 29: | Line 36: |
| *Operational test(for power unit) acquisition and analysis of thermal data. *Main board(WDS main PCB) mounting and implementation. |
Agenda/Minutes of the VIS Meeting on 2017/3/24
2017/3/24 13:30 -
Participants:
Progress report
Type-A (Takahashi)
Past week report
Plan for coming weeks
Type B (Mark)
Past week report
Plan for coming weeks
Type-Bp (Shoda)
Past week report
Plan for coming weeks
IMMT (Ohishi)
Past week report
Plan for coming weeks
Watchdog system (Tanaka)
Past week report
- Manufacturing test(Solder reflow process)
- The Power unit(substrate) is divided and processed in a reflow oven.
- There is no problem even though some solder leakage occurs on the upper part surface.
- The Power unit(substrate) is divided and processed in a reflow oven.
- Operational test(Power unit for 4ch WDS main box)
- Continuous operation for 6 hours at twice normal load(334mA).
Representation temperature of component surface(upper part) is 51℃(at room temp. 22℃). -->no problem.
- Continuous operation for 6 hours at twice normal load(334mA).
Plan for coming weeks
- Operational test(for power unit) acquisition and analysis of thermal data.
- Main board(WDS main PCB) mounting and implementation.
Safety
- Incidents:
- Foreseen risks
- Type-A:
- Type-B:
- Type-Bp:
Discussion
Travel Plans
- Travel (Week of 3/27):
- Takahashi:
- Shoda:
- Mark:
- Fabian:
- Okutomi:
- Fujii:
- Ishizaki:
- Hirata:
- Sato:
- Enzo:
- Hashimoto (Hosei Univ.):
- Ohishi:
- Tanaka:
- Perry:
- Travel (Week of 4/3):
- Takahashi:
- Shoda:
- Mark:
- Fabian:
- Okutomi:
- Fujii:
- Ishizaki:
- Hirata:
- Sato:
- Enzo:
- Hashimoto (Hosei Univ.):
- Ohishi:
- Tanaka:
Next meeting
On 2017/3/31(Fri)