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Schedule Chart : ([[https://www.dropbox.com/s/rlnmlt3uipcsai8/VIS%20Overall%20Schedule-20170121.pdf?dl=0|PDF]],[[https://www.dropbox.com/s/rlnmlt3uipcsai8/VIS%20Overall%20Schedule-20170121.pdf?dl=0|MPP]]) Schedule Chart : ([[https://www.dropbox.com/s/3fllgzwp4wlew2k/VIS%20Overall%20Schedule-20170322.pdf?dl=0|PDF]],[[https://www.dropbox.com/s/agsjc8jqo2t6vxu/VIS%20Overall%20Schedule-20170322.mpp?dl=0|MPP]])
Line 12: Line 12:
Installation in Y-end:

13th(Mon)
  * Assembled cables for PCV for the BF damper.
  * Started cabling between the BF and the F3.
14th(Tue)
  * Continued cabling between the BF and the F3.
  * All cables reached the EQ stop for F3.
15th(Wed)
  * Tuned the F3 after cabling.
  * The effective weight of cables was about 1kg. It was larger than our prediction.
  * Removed the ballast mass inside the BF.
16th(Thu)
  * Repaired the stepping motor driver and modified the release sensor monitor.
17th(Fri)
  * Assembled the end plate for F2.

21st(Tue)
  * Calibrated the LVDT of F3 using the digital system.
  * The keystone of BF was not working.
22nd(Wed)
  * Took the F2 from the box and moved it into the clean booth.
  * Lifted up the DP stage and adjusted the weight of DP.
23rd(Thu)
  * Lifted down the BF stage into the corrugate tube.
  * The position of keystone on the F3 was too high.
  * The cable cramp on the bottom of BF was hitting the release sensor.
  * Adjusted the yaw rotation of BF.
Line 13: Line 42:
 * Assemble the F2 stage.
Line 28: Line 58:
 *Manufacturing test(Solder reflow process)
   *The Power unit(substrate) is divided and processed in a reflow oven.
    There is no problem even though some solder leakage occurs on the upper part surface.
 *Operational test(Power unit for 4ch WDS main box)
   *Continuous operation for 6 hours at twice normal load(334mA).
     Representation temperature of component surface(upper part) is 51℃(at room temp. 22℃). -->no problem.
Line 29: Line 66:
 *Operational test(for power unit) acquisition and analysis of thermal data.
 
 *Main board(WDS main PCB) mounting and implementation.

Agenda/Minutes of the VIS Meeting on 2017/3/24

2017/3/24 13:30 -

Participants:

Progress report

Schedule Chart : (PDF,MPP)

Type-A (Takahashi)

Past week report

Installation in Y-end:

13th(Mon)

  • Assembled cables for PCV for the BF damper.
  • Started cabling between the BF and the F3.

14th(Tue)

  • Continued cabling between the BF and the F3.
  • All cables reached the EQ stop for F3.

15th(Wed)

  • Tuned the F3 after cabling.
  • The effective weight of cables was about 1kg. It was larger than our prediction.
  • Removed the ballast mass inside the BF.

16th(Thu)

  • Repaired the stepping motor driver and modified the release sensor monitor.

17th(Fri)

  • Assembled the end plate for F2.

21st(Tue)

  • Calibrated the LVDT of F3 using the digital system.
  • The keystone of BF was not working.

22nd(Wed)

  • Took the F2 from the box and moved it into the clean booth.
  • Lifted up the DP stage and adjusted the weight of DP.

23rd(Thu)

  • Lifted down the BF stage into the corrugate tube.
  • The position of keystone on the F3 was too high.
  • The cable cramp on the bottom of BF was hitting the release sensor.
  • Adjusted the yaw rotation of BF.

Plan for coming weeks

  • Assemble the F2 stage.

Type B (Mark)

Past week report

Plan for coming weeks

Type-Bp (Shoda)

Past week report

Plan for coming weeks

IMMT (Ohishi)

Past week report

Plan for coming weeks

Watchdog system (Tanaka)

Past week report

  • Manufacturing test(Solder reflow process)
    • The Power unit(substrate) is divided and processed in a reflow oven.
      • There is no problem even though some solder leakage occurs on the upper part surface.
  • Operational test(Power unit for 4ch WDS main box)
    • Continuous operation for 6 hours at twice normal load(334mA).

      • Representation temperature of component surface(upper part) is 51℃(at room temp. 22℃). -->no problem.

Plan for coming weeks

  • Operational test(for power unit) acquisition and analysis of thermal data.
  • Main board(WDS main PCB) mounting and implementation.

Safety

  • Incidents:
  • Foreseen risks
    • Type-A:
    • Type-B:
    • Type-Bp:

Discussion

Travel Plans

  • Travel (Week of 3/27):
    • Takahashi:
    • Shoda:
    • Mark:
    • Fabian:
    • Okutomi:
    • Fujii:
    • Ishizaki:
    • Hirata:
    • Sato:
    • Enzo:
    • Hashimoto (Hosei Univ.):
    • Ohishi:
    • Tanaka:
    • Perry:
  • Travel (Week of 4/3):
    • Takahashi:
    • Shoda:
    • Mark:
    • Fabian:
    • Okutomi:
    • Fujii:
    • Ishizaki:
    • Hirata:
    • Sato:
    • Enzo:
    • Hashimoto (Hosei Univ.):
    • Ohishi:
    • Tanaka:

Next meeting

On 2017/3/31(Fri)

KAGRA/Subgroups/VIS/VISMinutes20170324 (last edited 2017-03-24 14:53:02 by YoichiAso)