Differences between revisions 1 and 11 (spanning 10 versions)
⇤ ← Revision 1 as of 2017-02-15 15:26:01 →
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Editor: YoichiAso
Comment:
← Revision 11 as of 2017-02-17 13:09:27 → ⇥
Size: 3942
Editor: RyutaroTakahashi
Comment:
Deletions are marked like this. Additions are marked like this.
Line 8: Line 8:
Schedule Chart : ([[https://www.dropbox.com/s/rlnmlt3uipcsai8/VIS%20Overall%20Schedule-20170121.pdf?dl=0|PDF]],[[https://www.dropbox.com/s/rlnmlt3uipcsai8/VIS%20Overall%20Schedule-20170121.pdf?dl=0|MPP]]) Schedule Chart : ([[https://www.dropbox.com/s/myra6xk5v2mixit/VIS%20Overall%20Schedule-20170215.pdf?dl=0|PDF]],[[https://www.dropbox.com/s/whnsxrw9zizq3al/VIS%20Overall%20Schedule-20170215.mpp?dl=0|MPP]])
Line 12: Line 12:
 * Installation in Y-end:
13th(Mon)
  * Installed the protection net to the bottom of cross tube.
  * Released the keystone of BF. The weight of dummy payload was near the optimal load of BF.
14th(Tue)
  * Tuned the weight of dummy payload.
  * Started cabling around the BF and the dummy payload. Finished on 16th.
15th(Wed)
  * Started making the short cable for the LVDT on BF. Not finished.
  * Prepared the LVDT driver with the oscillator and the oscilloscope.
  16th(Thu)
  * Cariblated the LVDT on BF.
  * Checked the range of FR on BF. It was about 2mm. Additional blades are necessary.
 * Maraging wire: The 3.3m wire will be treated at Himeji facility of Kinzoku-giken. It takes one month.
Line 13: Line 28:
 * Adjust the BF.
 * Assemble the BF damper.
 * Assemble the EQ stop for F3 and set the F3.
Line 28: Line 46:
  *Items that have been delivered.
    *PCB + Metal mask( for Main board(WSD) )
    *Cream solder
  *Redesign(Front panel board for Main 4ch WDS Box and front panel for Ex-I/O Box)Adjust the spacing of the front panel conectors.
    *Project-WDS Peripheral circuit PCB Design Ver2(Summary)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706266/001/Project%20WDS%20Peripheral%20circuit%20PCB%20Design%20Ver2-Summry170216.pdf|PDF JGW-E1706266]]
    *Project-WDS Peripheral circuit PCB Design Version 2(Detail)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706265/001/Project%20WDS%20Peripheral%20circuit%20PCB%20Design%20Ver2%28Detail%29170217.pdf|PDF JGW-E1706265]]
    *Project-WDS Ex-I/O PCB Design Ver 1(Summary)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706268/002/Project%20WDS%20Ex-IO%20PCB%20Design%20Ver1_1%28Summary%29170217.pdf|PDF JGW-E1706268]]
    *Project-WDS Ex-I/O PCB Design Ver 1(Detail)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706267/001/Project%20WDS%20Ex-IO%20PCB%20Design%20Ver1%28Detail%29170217.pdf|PDF JGW-E1706267]]
Line 29: Line 56:
  *I'm planning to perform surface mounting for Power board(WDS Main 4ch Box) in reflow furnace in Akihabara.Since a large PCB size( 320mm * 100mm) is required,a large reflow furnace is necessary,so it can be borrowed in Akihabara(DMM-make site.And of course,paid).
    *ref Peripheral board(Power)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0061/E1706101/001/Project%20WDS%20PCB%20Design%20Ver1%28Detail%29170127.pdf|PDF]]
    *ref Reflow furnace[[https://akiba.dmm-make.com/about/machinesDetail/46|Japanese]]
Line 39: Line 68:
 * Mirror disassembly jigs (Hirata)
Line 43: Line 73:
  * Takahashi: 13-16
  * Shoda: 13-16
  * Mark: 13-16
  * Fabian: 13-16
  * Okutomi: 13-16
  * Fujii:
  * Ishizaki: 13-16
  * Hirata:
  * Sato: 13-16
  * Enzo:
  * Hashimoto (Hosei Univ.): 13-16
  * Someya (Hosei Univ.): 13-16
  * Ohishi:		   * Takahashi: 20- 24
  * Shoda: 21 - 24
  * Mark: 20 - 24
  * Fabian: 20 - 24
  * Okutomi: 20 - 22
  * Fujii: 
  * Ishizaki:  20 - 24
  * Hirata:  20 - 24
  * Sato: 20 - 24
  * Enzo:  20 - 24
  * Hashimoto (Hosei Univ.):  20 - 24
  * Ohishi:    * Tanaka:

Agenda/Minutes of the VIS Meeting on 2017/2/17

2017/2/17 13:30 -

Participants:

Progress report

Schedule Chart : (PDF,MPP)

Type-A (Takahashi)

Past week report

  • Installation in Y-end:

13th(Mon)

  • Installed the protection net to the bottom of cross tube.
  • Released the keystone of BF. The weight of dummy payload was near the optimal load of BF.

14th(Tue)

  • Tuned the weight of dummy payload.
  • Started cabling around the BF and the dummy payload. Finished on 16th.

15th(Wed)

  • Started making the short cable for the LVDT on BF. Not finished.
  • Prepared the LVDT driver with the oscillator and the oscilloscope. 16th(Thu)
  • Cariblated the LVDT on BF.
  • Checked the range of FR on BF. It was about 2mm. Additional blades are necessary.
  • Maraging wire: The 3.3m wire will be treated at Himeji facility of Kinzoku-giken. It takes one month.

Plan for coming weeks

  • Adjust the BF.
  • Assemble the BF damper.
  • Assemble the EQ stop for F3 and set the F3.

Type B (Mark)

Past week report

Plan for coming weeks

Type-Bp (Shoda)

Past week report

Plan for coming weeks

IMMT (Ohishi)

Past week report

Plan for coming weeks

Watchdog system (Tanaka)

Past week report

  • Items that have been delivered.
    • PCB + Metal mask( for Main board(WSD) )
    • Cream solder
  • Redesign(Front panel board for Main 4ch WDS Box and front panel for Ex-I/O Box)Adjust the spacing of the front panel conectors.

Plan for coming weeks

  • I'm planning to perform surface mounting for Power board(WDS Main 4ch Box) in reflow furnace in Akihabara.Since a large PCB size( 320mm * 100mm) is required,a large reflow furnace is necessary,so it can be borrowed in Akihabara(DMM-make site.And of course,paid).

    • ref Peripheral board(Power)PDF

    • ref Reflow furnaceJapanese

Safety

  • Incidents:
  • Foreseen risks
    • Type-A:
    • Type-B:
    • Type-Bp:

Discussion

  • Mirror disassembly jigs (Hirata)

Travel Plans

  • Travel (Week of 2/20):
    • Takahashi: 20- 24
    • Shoda: 21 - 24
    • Mark: 20 - 24
    • Fabian: 20 - 24
    • Okutomi: 20 - 22
    • Fujii:
    • Ishizaki: 20 - 24
    • Hirata: 20 - 24
    • Sato: 20 - 24
    • Enzo: 20 - 24
    • Hashimoto (Hosei Univ.): 20 - 24
    • Ohishi:
    • Tanaka:
  • Travel (Week of 2/27):
    • Takahashi:
    • Shoda:
    • Mark:
    • Fabian:
    • Okutomi:
    • Fujii:
    • Ishizaki:
    • Hirata:
    • Sato:
    • Enzo:
    • Hashimoto (Hosei Univ.):
    • Someya (Hosei Univ.):
    • Ohishi:
    • Tanaka:

Next meeting

On 2017/2/24(Fri) in Mitaka

March VIS F2F: March 3

KAGRA/Subgroups/VIS/VISMinutes20170217 (last edited 2017-02-17 21:18:27 by YoichiAso)