Differences between revisions 5 and 6

Agenda/Minutes of the VIS Meeting on 2017/2/17

2017/2/17 13:30 -

Participants:

Progress report

Schedule Chart : (PDF,MPP)

Items that have been delivered.
- PCB + Metal mask( for Main board(WSD) )
- Cream solder
Redesign(Front panel board for Main 4ch WDS Box and front panel for Ex-I/O Box)

Adjust the spacing of the front panel conectors.

I'm planning to perform surface mounting for Power board(WDS Main 4ch Box) in reflow furnace in Akihabara.Since a large PCB size( 320mm * 100mm) is required,a large reflow furnace is necessary,so it can be borrowed in Akihabara(DMM-make site.And of course,paid).
ref Peripheral board(Power)PDF
ref Reflow furnaceJapanese

On 2017/2/24(Fri) in Mitaka

March VIS F2F: March 3

KAGRA/Subgroups/VIS/VISMinutes20170217 (last edited 2017-02-17 21:18:27 by YoichiAso)

-  ⇤ ← Revision 5 as of 2017-02-16 17:30:10 → 
  Size: 2067
  Editor: NobuyukiTanaka
  Comment:
+   ← Revision 6 as of 2017-02-17 11:34:13 → ⇥
  Size: 3121
  Editor: NobuyukiTanaka
  Comment:
-Deletions are marked like this.
+Additions are marked like this.
 Line 28:
+  *Items that have been delivered.
    *PCB + Metal mask( for Main board(WSD) )
    *Cream solder
  *Redesign(Front panel board for Main 4ch WDS Box and front panel for Ex-I/O Box)
Adjust the spacing of the front panel conectors.
  *Project-WDS Peripheral circuit PCB Design Ver2(Summary)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706266/001/Project%20WDS%20Peripheral%20circuit%20PCB%20Design%20Ver2-Summry170216.pdf|PDF JGW-E1706266]]
  *Project-WDS Peripheral circuit PCB Design Version 2(Detail)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706265/001/Project%20WDS%20Peripheral%20circuit%20PCB%20Design%20Ver2%28Detail%29170217.pdf|PDF JGW-E1706265]]
  *Project-WDS Ex-I/O PCB Design Ver 1(Summary)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706268/002/Project%20WDS%20Ex-IO%20PCB%20Design%20Ver1_1%28Summary%29170217.pdf|PDF JGW-E1706268]]
  *Project-WDS Ex-I/O PCB Design Ver 1(Detail)[[http://gwdoc.icrr.u-tokyo.ac.jp/DocDB/0062/E1706267/001/Project%20WDS%20Ex-IO%20PCB%20Design%20Ver1%28Detail%29170217.pdf|PDF JGW-E1706267]]