Agenda/Minutes of the VIS Meeting on 2017/2/17

2017/2/17 13:30 -

Participants:

Progress report

Schedule Chart : (PDF,MPP)

Type-A (Takahashi)

Past week report

Plan for coming weeks

Type B (Mark)

Past week report

Plan for coming weeks

Type-Bp (Shoda)

Past week report

Plan for coming weeks

IMMT (Ohishi)

Past week report

Plan for coming weeks

Watchdog system (Tanaka)

Past week report

• Items that have been delivered.
  • PCB + Metal mask( for Main board(WSD) )
  • Cream solder
• Redesign(Front panel board for Main 4ch WDS Box and front panel for Ex-I/O Box)Adjust the spacing of the front panel conectors.

  • Project-WDS Peripheral circuit PCB Design Ver2(Summary)PDF JGW-E1706266

  • Project-WDS Peripheral circuit PCB Design Version 2(Detail)PDF JGW-E1706265

  • Project-WDS Ex-I/O PCB Design Ver 1(Summary)PDF JGW-E1706268

  • Project-WDS Ex-I/O PCB Design Ver 1(Detail)PDF JGW-E1706267

Plan for coming weeks

• I'm planning to perform surface mounting for Power board(WDS Main 4ch Box) in reflow furnace in Akihabara.Since a large PCB size( 320mm * 100mm) is required,a large reflow furnace is necessary,so it can be borrowed in Akihabara(DMM-make site.And of course,paid).

  • ref Peripheral board(Power)PDF

  • ref Reflow furnaceJapanese

Safety

• Incidents:
• Foreseen risks
  • Type-A:
  • Type-B:
  • Type-Bp:

Discussion

• Mirror disassembly jigs (Hirata)

Travel Plans

• Travel (Week of 2/20):
  • Takahashi: 20- 24
  • Shoda: 21 - 24
  • Mark: 20 - 24
  • Fabian: 20 - 24
  • Okutomi: 20 - 22
  • Fujii:
  • Ishizaki: 20 - 24
  • Hirata: 20 - 24
  • Sato: 20 - 24
  • Enzo: 20 - 24
  • Hashimoto (Hosei Univ.): 20 - 24
  • Ohishi:
  • Tanaka:
• Travel (Week of 2/27):
  • Takahashi:
  • Shoda:
  • Mark:
  • Fabian:
  • Okutomi:
  • Fujii:
  • Ishizaki:
  • Hirata:
  • Sato:
  • Enzo:
  • Hashimoto (Hosei Univ.):
  • Someya (Hosei Univ.):
  • Ohishi:
  • Tanaka:

Next meeting

On 2017/2/24(Fri) in Mitaka

March VIS F2F: March 3