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Agenda/Minutes of the VIS Meeting on 2017/3/24

2017/3/24 13:30 - 14:45

Participants: Mark, Enzo, Perry, Ohishi, Fabian, Hirata, Aso, Tanaka, Shoda, Raffaele, Takahashi, Sato, Ishizaki, Okutomi

Progress report

Schedule Chart : (PDF,MPP)

* Type-A: 2 weeks delay (delay by F2F is taken into account). Try to recover with F2 installation and skipping some part of the PI tuning. * Type-B: Steady progress but 4 weeks delay (out of which, 1 week delay is due to the F2F meeting). Shorten the 3 week long full-TF measurement. * Type-Bp: On schedule (F2F is taken into account).

Type-A (Takahashi)

Past week report

Installation in Y-end:

13th(Mon)

• Assembled cables for PCV for the BF damper.
• Started cabling between the BF and the F3.

14th(Tue)

• Continued cabling between the BF and the F3.
• All cables reached the EQ stop for F3.

15th(Wed)

• Tuned the F3 after cabling.
• The effective weight of cables was about 1kg. It was larger than our prediction.
• Removed the ballast mass inside the BF.

16th(Thu)

• Repaired the stepping motor driver and modified the release sensor monitor.

17th(Fri)

• Assembled the end plate for F2.

21st(Tue)

• Calibrated the LVDT of F3 using the digital system.
• The keystone of BF was not working.

22nd(Wed)

• Took the F2 from the box and moved it into the clean booth.
• Lifted up the DP stage and adjusted the weight of DP.

23rd(Thu)

• Lifted down the BF stage into the corrugate tube.
• The position of keystone on the F3 was too high.
• The cable cramp on the bottom of BF was hitting the release sensor.
• Adjusted the yaw rotation of BF.

24th(Fri)

• Checked the motion of F3 and BF GAS filters.
• Lifted down the BF stage into the corrugate tube again.

Plan for coming weeks

• Assemble the F2 stage.

Type B (Mark)

Report for week of 3/13

At Kamioka (Mark, Fabian, Enzo, Perry, Hirata-san):

• We took a full set of TFs with the BF stationary but the IRM, IM, RM and TM all hanging.
• We marked peeling or damaged areas on the clean booth floor for Furuta-san.
• We installed the SF, measuring its weight in the process.
• We found the crossbars supporting the SF jacks were too high to allow the SF ring to sit on the pillars while also being partially supported by the jacks. (This was an issue with the 3D CAD - the model of the NB-01 jack had a lower minimum height than reality.) We lowered the crossbars by 5 mm and put thicker spacers (12 mm instead of 3 mm) on top of the jacks supporting the SF and everything worked well.
• We installed newly cleaned L-brackets under the BF and SF.
• We installed a new-style cable clamp under the SF. (This was easier with the SF on the security structure, so we had not done it earlier.)
• We installed the SF-BF rod and hex cable clamp.
• We suspended the BF/IRM/IM/RM/BS section and found it was light, presumably because it had been trimmed according to the Promec measurement of the SF, not Hirata-san's later value.
• We added extra ballast mass corresponding to the difference and found the BF section floated at a good height.
• We moved trim mass around on the BF until it hung level, and adjusted the IRM and OSEMs until the IRM-IM EQ stops were well-centered and all the OSEMs were centered laterally and mid-range.
• We ran 11 extra 20-m in-air cables from the tank towards the rack. (We will need to add 10-m extensions.)
• We connected most of the cables to the vacuum flanges with screws and anti-feedthrough adapters. (Some remain to be done.)
• We debugged a 900 Hz ringing in the BF LVDT, which turned out to be because the damping was enabled without appropriate filters or gains.
• We debugged excess noise in the TM-H3 OSEM, which turned out to be mostly due to a faulty cable. However we worry that some of it may be due to some extensions made of non-vacuum-compatible ribbon cable which we added because the TM-H2 and -H3 OSEM cables are too short.
• We installed new security structure parts at the RM level.
• We found all the parts for the lower breadboard suspension, including the blades, blade bases, associated cable clamps etc. We also found the jigs for installing the blades.
• Fabian finalized the BF ballast mass design and started on the SF.

Report for week of 3/21

At Kamioka (Mark, Fabian, Enzo, Perry, Hirata-san):

• We took a full set of TFs with the SF stationary but the BF, IRM, IM, RM and TM all hanging.
• We also did a TF from BF LVDT actuation and confirmed that it was working.
• We got SUMCON running on Perry's computer and worked out how to do cut-down versions of Fabian's full Type-B model corresponding to the various partial configurations we have data for.
• We re-routed most of the in-vac cabling past the BF up to the SF.
• Finished all the in-air cabling to the rack except for the pico drivers.
• We cleared the floor to be ready for re-coating work.

Plan for coming weeks

For more detail, see KAGRA/Subgroups/VIS/TypeB/ToDo.

Week of 3/27:

• f2f Meeting

Week of 4/2:

• Set up again after floor coating work.
• Move PI into clean booth.
• Finish all RM/IRM/BF/SF in-vac cabling and all in-air cabling.
• Ballast/trim/weigh SF/BF/IRM/IM/RM/TM section.

Type-Bp (Shoda)

Past week report

• Measurement in the vacuum chamber
  • BF LVDT connection was wrong. After we corrected them, we could measure the TFs and damp the BF.
  • The whole chain resonance mode was properly damped by active damping at the BF stage. See the JPS meeting slides for the details.
• Test hanging is done.
  • The suspension chain was took out from the vacuum tank.
  • We removed the mirror first by cutting the wire. RM/TM unit is now wrapped and put in pelican box.
  • All the parts are disassembled without any accidents.
• BF LVDTs are calibrated. The result will be updated soon.
• PR3 preperation
  • IM was set at the proper position for PR3 hanging
  • Gluing is now on going at Kashiwa.

Plan for coming weeks

• F2F meeting
• Mirror hanging will start from 3rd April.

IMMT (Ohishi)

Past week report

Plan for coming weeks

Watchdog system (Tanaka)

Past week report

• Manufacturing test(Solder reflow process)
  • The Power unit(substrate) is divided and processed in a reflow oven.
    • There is no problem even though some solder leakage occurs on the upper part surface.
• Operational test(Power unit for 4ch WDS main box)
  • Continuous operation for 6 hours at twice normal load(334mA).

    • Representation temperature of component surface(upper part) is 51℃(at room temp. 22℃). -->no problem.

Plan for coming weeks

• Operational test(for power unit) acquisition and analysis of thermal data.
• Main board(WDS main PCB) mounting and implementation.

Safety

• Incidents: no
• Foreseen risks
  • Type-A: crane works
  • Type-B: Crane the PI. Ask some expert (Sawada-san or Shindo-san) to help.
  • Type-Bp: Mirror hanging

Discussion

Travel Plans

• Travel (Week of 3/27):
  • Takahashi:
  • Shoda:
  • Mark:
  • Fabian:
  • Okutomi:
  • Fujii:
  • Ishizaki:
  • Hirata:
  • Sato:
  • Enzo:
  • Hashimoto (Hosei Univ.):
  • Ohishi:
  • Tanaka:
  • Perry:
• Travel (Week of 4/3):
  • Takahashi: 3-6
  • Shoda: 3-6
  • Mark: 3-6
  • Fabian: 3-6
  • Okutomi: 3-6
  • Fujii:
  • Ishizaki: ?-6
  • Hirata: 3-6
  • Sato: 3-6
  • Enzo: 3-6
  • Ohishi:
  • Tanaka:
  • Perry: 3-7
  • Sekiguchi(Hosei): ?-?
  • Hirayama(Hosei): ?-?
  • Wada (Ando Lab.): 3-5

Next meeting

On 2017/3/31(Fri) VIS F2F: April 7